Automatic dual-wave soldering machine with its fluxer and preheat tunnel, finger conveyor and titanium solder pot

Projects · Anonymised programme results

Five projects, five constraints, five measured results.

These are five programmes written the only way we will write them: client type, region, board class, the constraint that made the job hard, what changed on our side, and the number that moved — for instance first-pass yield from 93% to 98.6% on a 14-layer controller board, and solder-joint rework from 4.1% to 0.3% on a heavy-copper power board. Names are withheld under NDA, and no projection appears in place of a result.

How to read these

Why there is no logo wall on this page

Every case is anonymised

Each record is written as client type, region and board class. Names are withheld under NDA — the same NDA that will cover your Gerber files and BOM.

Constraint first, result second

Each case states the constraint, what changed on our side, and the measured result. We do not publish projections.

Per programme, not per site

Figures are that programme's results, not a site-wide average; our site-wide KPIs are published on the Quality page with their measurement definitions.

No invented names, ever

No customer name, logo or testimonial appears anywhere on this site, and we will not invent one.

Industrial & medical

Two programmes where the criterion was the hard part

Case 01 · Industrial automation · Germany

Fourteen-layer controller board

0.4 mm pitch BGA and 01005 chip passives mixed on the same side, with incoming voiding from the previous supplier above the limit the programme could accept.

Constraint
Fine-pitch BGA + 01005 mix
What changed
IPC-7095 Class 2 criteria + nitrogen reflow
Result
FPY 93% → 98.6% at volume
Also
Incoming inspection moved from full inspection to AQL sampling

14-layer control board, volume production

Case 02 · Medical · USA

Eight-layer monitor board

A Class II device programme that could not start until the quality system and the traceability chain both satisfied the customer's own notified-body commitments.

Constraint
ISO 13485 system + lot traceability
What changed
Lot traceability built out, IQ/OQ/PQ documentation pack issued
Result
Three years of volume production
Also
No field recalls in three years of volume production

8-layer monitor board, three-year production record

What moved

Four results, each labelled with the programme it came from

  • 93% → 98.6% First-pass yield

    14-layer control board, industrial automation, Germany — measured at volume after the voiding criteria and the reflow atmosphere were changed.

  • 4.1% → 0.3% Solder-joint rework

    6-layer heavy-copper power board, automotive and EV, Nordics — after selective soldering replaced hand touch-up on the through-hole joints.

  • 12 working days Prototype delivery

    4-layer double-sided mixed-technology board, consumer and IoT, USA — including a DFM land-pattern redesign before the stencil was cut.

  • +5 years Product lifecycle

    2-layer power board, energy, Netherlands — after a BOM risk scan, second-source qualification and a last-time-buy stock plan.

Industrial automation · Germany, USA — Medical · USA — Automotive / EV · Nordics — Consumer / IoT · USA — Energy · Netherlands

Automotive & consumer

Two programmes where the process, not the design, moved the number

Case 03 · Automotive & EV · Nordics

Six-layer heavy-copper power board

A 3 oz copper power board whose through-hole joints needed a heat input that hand soldering could not deliver consistently across a production lot.

Constraint
3 oz copper + selective soldering
What changed
Robotic selective soldering replaced hand touch-up
Result
Solder-joint rework 4.1% → 0.3%
Why it held
Single-point nozzle heat, repeatable across the lot

6-layer, 3 oz copper power board

Case 04 · Consumer & IoT · USA

Four-layer double-sided mixed assembly

A hardware start-up with a fixed twelve-day window before a certification slot, and a land-pattern problem that would have surfaced as a reflow defect if it had been built as drawn.

Constraint
Prototype in 12 days, DFM redesign included
What changed
Land-pattern redesign first, stencil cut after
Result
Prototype shipped in 12 working days
Also
Certification testing passed first time; moved straight into pilot volume

4-layer double-sided mixed-technology board

How your program starts

Five gates between a Gerber file and a released lot

High-layer-count backplane standing on edge, its cut laminate revealing the layer stack, with dense press-fit connector fields across the surface

The same sequence on every programme

A programme does not jump from quotation to volume. It passes five gates, and each gate produces a document you keep — which is why the dates we quote are built from the gates rather than from an average.

Gate 01 · DFM / DFA review
First report inside 24 h on prototype builds
Gate 02 · Stencil and fixtures
Laser-cut nano-coated stainless; ICT/FCT fixtures
Gate 03 · First article
FAI report with SPI and AOI data
Gate 04 · Pilot build
Small-batch run before volume release
Gate 05 · Volume release
PPAP or a customer-defined release package

Dates are quoted as an assembly lead time ex-components, measured from the point the component set is complete at our dock rather than from the purchase order. Component availability is the variable that matters: long-lead semiconductors can add 12–26 weeks ahead of assembly, and we would rather put that on the quotation than discover it in week three.

When a part disappears

The programme that would have ended at a last-time buy

Case 05 · Energy · Netherlands

Two-layer power board on a dead component

A grid-equipment programme with a mature design ran into a component that the manufacturer had put on end-of-life, with no pin-compatible successor. The board worked; the supply chain for it did not.

Client type
Grid equipment manufacturer
Region
Netherlands
Board class
2-layer power board
Constraint
Discontinued part, last-time buy required

We ran a BOM risk scan across lifecycle status, single-source lines and long-lead items, then qualified a second source against the datasheet parameters and the customer's approved vendor list, before writing a last-time-buy stock plan for the parts that could not be replaced. No automatic substitution: every alternative on that list was confirmed in writing by the customer before it was placed.

Result: product lifecycle extended by five years, without a board redesign

Build evidence

What a prototype-tier assembly looks like before it scales

Compact double-sided wearable circuit assembly with a densely populated fine-pitch area, an antenna trace and a coin-cell holder

FOUR-LAYER DOUBLE-SIDED MIXED-TECHNOLOGY BUILD · PROTOTYPE TIER

What this station proves

Nothing on this page is a render. Each board shown was built on the lines described in the Factory section, and the constraint quoted with it is the one that governed the work order.

Softly lit out-of-focus circuit board surface with faint copper traces and via pads

Next step

Put your constraint on this list

Tell us the board class, the package mix, the test coverage and the date you are working towards. We will answer with the gates your programme needs, the assembly lead time ex-components, and the constraint we expect to be the hard one.

Reply within one business day

Your Gerbers and BOM sit under the same NDA that keeps the five programmes on this page anonymous.