Industries · PCBA builds by vertical
PCBA contract manufacturing across SMT, through-hole and mixed-technology assembly for six regulated verticals. Medical starts with an ISO 13485 scope statement; automotive starts with IATF 16949 and a PPAP file. The paperwork and the inspection criteria are not the same, so we configure inspection scope and approval documents per project rather than claiming one process covers all six. 7 SMT lines, 2 THT lines, 300,000+ boards a month, one 10,000 m² plant in Shenzhen.
Six verticals
Every card below states the regime your supplier audit will be judged against. They differ enough that the documents, the acceptance class and the traceability depth change with the vertical — which is why the six detail pages carry different tables.
No mandatory QMS — but ISO 9001 and 10–15 year supply continuity are the entry ticket; UL 508A applies to US control panels.
Wide-temperature builds at −40…+85 °C, selective soldering for mixed through-hole, acceptance to IPC-A-610 Class 2 with Class 3 for 24/7 duty.
Open verticalISO 13485:2016 QMS with lot-level traceability under FDA 21 CFR 820 and EU MDR 2017/745.
Lot-level traceability, IQ/OQ/PQ validation documentation, change notification before any process change, and cleanliness verified by ROSE ionic contamination testing to IPC-TM-650.
Open verticalIATF 16949:2016 with PPAP submission and AEC-Q100/Q101/Q200 parts.
Registered scope covers manufacturing of circuit board components, with the permitted product-design exclusion declared. Temperature cycling at −40…+125 °C, functional test fixtures and retained process data on power and control boards.
Open verticalFCC Part 15, CE RED 2014/53/EU, RoHS and WEEE — the OEM holds the finished-device conformity.
Prototype-to-volume ramp on 01005 and 0.4 mm pitch packages, with DFM feedback inside 24 hours on prototype boards and 3–7 working day turns on 1–10 piece builds.
Open verticalUL 508A for control panels, IEC 62477 for power converters, UL 1741 / IEEE 1547 for grid connection.
Heavy-copper power assemblies from audited partner fabs, void acceptance to IPC-7095, conformal coating to IPC-CC-830 with UV inspection, and long-life supply planning for parts that must run 15–25 years.
Open verticalNEBS (Telcordia GR-63-CORE / GR-1089-CORE) and RoHS for carrier-grade hardware.
Press-fit connector seating, mixed-technology assembly and X-ray scoped per project on high-layer-count boards, with the assembly envelope stated up front as 0.4–4.0 mm board thickness.
Open verticalSide by side
Same factory, different proof. The table compares what each vertical asks a supplier to hold against what we actually hold or measure — including the items that are declarations rather than certificates.
| Industry | Regulatory regime | What approval usually requires | VOLTCIRCUIT scope and parameters |
|---|---|---|---|
| Industrial automation & controlsNo mandatory vertical QMS | Customer audit requirements on top of ISO 9001; UL 508A applies at panel level and is held by the panel builder | A quality management system certificate, documented wide-temperature build records, and a written position on component obsolescence and PCN/EOL notification | ISO 9001:2015 certified since 2024 for SMT and THT assembly production services; ISO 14001:2015 since 2023; wide-temperature component sourcing; PCN/EOL notification process |
| Medical devicesISO 13485:2016 | FDA 21 CFR 820 and EU MDR 2017/745 — the legal manufacturer carries those obligations, not the contract manufacturer | An ISO 13485 certificate whose scope names board assembly, lot-level traceability, IQ/OQ/PQ validation documentation, change notification, and records tied to the device history record | ISO 13485:2016 certified since 2021, scope Production of PCBA — a quality-management-system certificate, not an FDA clearance and not an EU MDR certificate; lot-level traceability; buyer audit right written into the quality agreement |
| Automotive & EVIATF 16949:2016 | IATF 16949 registration plus the customer's APQP and PPAP gates | Registered scope naming circuit board components, the permitted design exclusion declared, AEC-Q100/Q101/Q200 parts under approved-manufacturer control, an 8D channel, and retained inspection data | IATF 16949:2016 certified since 2024, scope Manufacturing of Circuit Board Components, with product design declared as a permitted exclusion; PPAP Level 3 submitted as the default when the customer does not specify; 8D channel with 24 h containment and 10-day root cause as the usual expectation |
| Energy, power & gridProduct certification stays with the OEM | UL 508A at panel level; IEC 62477 for power converter systems; UL 1741 and IEEE 1547-2018 for grid interconnection | Heavy-copper capability, creepage and clearance suited to the working voltage, flame-retardant laminate, declared void acceptance criteria, and a long-life supply plan | Heavy-copper bare boards sourced from audited partner fabs, with incoming inspection and full lot traceability; void acceptance to IPC-7095; conformal coating to IPC-CC-830; UL 94V-0 laminate specified on power boards; box build and cabinet integration available, though a panel's UL 508A listing is held by the panel builder |
| Consumer electronics & IoTConformity sits with the brand owner | FCC Part 15, RoHS and WEEE; radio products fall under CE RED 2014/53/EU, and EMC 2014/30/EU does not itself apply to radio equipment | Fast NPI turns, DFM feedback before tooling, cost steps at volume, and manufacturing support for the customer's own EMC and radio testing | DFM report inside 24 hours on prototype boards; 3–7 working day assembly on 1–10 pieces and 5–10 working days on 10–1,000 pieces as quoted. We support testing but cannot issue the CE conformity declaration ourselves, because that declaration belongs to the finished-device manufacturer. |
| Telecom & data-centre hardwareNEBS documentation | NEBS — Telcordia GR-63-CORE and GR-1089-CORE — with RoHS and REACH declarations | Carrier-grade acceptance class, controlled-impedance documentation, press-fit assembly, and process records a Tier 1 carrier will accept | Press-fit insertion, mixed-technology assembly and selective soldering; assembly envelope 0.4–4.0 mm board thickness; layer count, back-drilling and impedance coupons belong to the bare-board fab; we prepare process and materials documentation for the buyer's NEBS submission |
Capacity across the six
Contract manufacturing from a single Shenzhen site.
SMT, THT, test and box build under one roof, including an ISO Class 8 clean area.
Seven high-speed SMT lines, two through-hole lines, two functional-test lines.
Single-site monthly board output across all verticals.
About 75% of revenue comes from Europe and North America.
Derived as 7 lines × 84,000 CPH × 24 h × 40% overall equipment effectiveness — a calculated sustained rate, not a measured run.
Three verticals, three records
Cases are anonymised by design: customer type, region, constraint and result. Full records for each vertical sit on its own page.
A German industrial-controls OEM moved a 14-layer controller board to our line after the previous supplier failed void acceptance.
Result: FPY 93% → 98.6%; IQC full inspection → AQL sampling
A US Class II device company required an ISO 13485 system and traceability down to component lot before releasing volume.
Result: 3 years in volume, 0 field recalls
A Dutch grid-equipment maker lost a key component to discontinuation while the product still had years of committed service life.
Result: product life extended 5 years
Verify it yourself
Approval documents are usually the first thing a buyer audits and the last thing a supplier can fake. Four of ours are open to inspection, and one thing we deliberately do not publish.
Lot-level traceability ties every shipment to the bare-board lot, the component lots consumed and the process records for that run — cartons carry the lot identification that opens the record.
Traceability basis: lot-level records on every shipment
The buyer audit right is a clause in the quality agreement, not a verbal assurance. A scheduled visit can walk the line, the inspection stations and the retained records for your own part numbers, on a date you choose.
Contractual: audit right written into the quality agreement
Declarations and reports are supplied on request as documents: RoHS 3 (EU) 2015/863 and REACH SVHC compliance statements, a CMRT for 3TG smelter and refiner sourcing, and IPC-A-610 acceptance-class declarations covering the assemblies we build.
Available on request: RoHS 3 · REACH SVHC · CMRT · IPC-A-610
We publish no certificate registration numbers, and no customer names or logos. Certificates are shown as badges and shared as copies during your supplier qualification, which keeps them verifiable through the issuing body rather than through our marketing.
Policy: no certificate numbers, no customer names on site
Next step
Send the BOM, the Gerbers and the acceptance class your auditor expects. We will confirm which documents we can issue, which parameters we can hold, and where a partner fab or your own design owner sits in the chain. Assembly lead time ex-components; long-lead semiconductors can add 12–26 weeks.
Reply within one business day
Minimum order quantity is set by the package, not by us: 0603–2225, SOT, SOD and MELF parts begin at 50 pcs plus 30 spares, other packages at 100 pcs plus 50 spares. Prototypes are quoted per project.
Still comparing verticals? Read the assembly capabilities, the quality and inspection scope, or the industrial automation page.
