LINE 01 · REFLOW
SMT Assembly
01005 / 03015 up to 100 × 90 mm and 28 mm tall, QFP and BGA at 0.4 mm pitch, ±25 µm placement accuracy from machines rated at 84,000 CPH.
CAPABILITIES · SEVEN LINES, ONE WORK ORDER
Seven capability lines. One work order.
SMT, through-hole / DIP and mixed-technology assembly run on 7 SMT lines and 2 THT lines inside one 10,000 m² plant in Shenzhen — 300,000+ boards a month, from 01005 parts at 0.4 mm pitch. Everything below exists to route your board to the line that will actually build it.
MATERIAL FLOW
A board enters here and leaves packed
One direction, no branch offices: every panel travels the same seven stations, and each station carries the parameter it is held to.
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01 Solder paste printing
Automatic printer, laser-cut stainless stencil, area ratio ≥0.66
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02 3D SPI
Volume · height · area · offset, fed back to the printer
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03 Placement
01005 / 03015 up to 100 × 90 mm, 28 mm tall, ±25 µm
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04 Reflow
10-zone forced-air, SAC305, optional nitrogen at O&sub2; ≤1000 ppm
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05 AOI
2D / 3D optical inspection, configured per project
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06 DIP & test
Dual-wave or selective soldering; ICT and FCT to the test plan
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07 Packaging
ESD bag, moisture-barrier bag, desiccant, humidity indicator card
BOARD-LEVEL LINES
Three lines solder the board itself
These three carry the soldering. The other four extend the same board into test, material, enclosure and volume.
LINE 02 · HOLE FILL
Through-Hole & DIP Assembly
Dual-wave soldering for whole-board heat, robotic single-nozzle selective soldering for localised heat. On mixed-technology boards the industry-typical defect rate is 500–2,000 PPM for wave against 50–200 PPM for selective.
LINE 03 · ONE RECORD
Mixed-Technology Assembly
Reflow, press-fit and hand soldering on one work order and one traceability record. The acceptance class (IPC-A-610 Class 2 or Class 3) is locked before the build is scheduled.
SINGLE SITE
Seven lines, one address, no subcontracting
The seven capability lines are not four suppliers behind one website. Printing, placement, reflow, DIP, test and pack sit on one 10,000 m² floor, which is why a mixed-technology board keeps one traceability record from paste to carton.
SMT lines7 · Panasonic NPM-D3
Rated placement speed84,000 CPH per machine
THT assembly lines2 · dual-wave + selective
Functional test lines2
Plant10,000 m², single site
Boards shipped300,000+ per month
ROUTING TABLE
Find your board, take the line
Read down the left column until a row matches the board in front of you. The fourth column is the page that carries the full parameter window.
| Your board | Route to | Governing parameter | Entry |
|---|---|---|---|
| All surface-mount, down to 01005 or 0.4 mm pitch | SMT Assembly | 01005 / 03015 to 100 × 90 mm and 28 mm tall; QFP 0.4 mm pitch; ±25 µm | /capabilities/smt-assembly/ |
| Connectors, transformers, high-current terminals | Through-Hole & DIP Assembly | Dual-wave turbulent + laminar; hole fill and wetting to IPC J-STD-001 | /capabilities/through-hole-dip/ |
| SMT and through-hole on one board, or press-fit pins | Mixed-Technology Assembly | One work order, one traceability record; acceptance class locked before scheduling | /capabilities/mixed-technology/ |
| Ball-grid or leadless packages, or an ICT / FCT requirement | Testing & Inspection | IPC-7095 void criteria; ICT cycle 5–30 seconds per board | /capabilities/testing-inspection/ |
| An NRND, EOL or single-source line in the BOM | Component Sourcing | Lifecycle status flagged line by line; long-lead semiconductors can add 12–26 weeks | /capabilities/component-sourcing/ |
| The deliverable is a unit, not a board | Box Build | Coating to IPC-CC-830, harness, programming, torque assembly, unit-level FCT | /capabilities/box-build/ |
| Starting at 5 pieces with volume to follow | Prototype to Production | 1–10 pieces in 3–7 working days; 5,000 pieces in about 3 weeks, same line | /capabilities/prototype-to-production/ |
| Firmware programming and unit serial numbers in scope | Box Build | Offline or in-line programming; serial number bound to build record and test data | /capabilities/box-build/ |
| Compliant press-fit pins instead of solder joints | Mixed-Technology Assembly | Insertion force controlled by tooling; no solder joint on those pins | /capabilities/mixed-technology/ |
| Thick-copper power stage, high-current terminals | Through-Hole & DIP Assembly | Hole fill to IPC J-STD-001 with X-Ray void review where specified | /capabilities/through-hole-dip/ |
| No test points available for a bed-of-nails fixture | Testing & Inspection | JTAG boundary scan to IEEE 1149.1 reaches interconnects a probe cannot | /capabilities/testing-inspection/ |
EXTENDING THE BOARD
Four lines that follow the board out of the printer
EVIDENCE
Testing & Inspection
3D SPI on volume, height, area and offset; 2D X-Ray under BGA, CSP and QFN judged to IPC-7095; ICT on a bed-of-nails fixture at 5–30 seconds per board.
MATERIAL
Component Sourcing
Every BOM line flagged Active, NRND or EOL, with single-source and long-lead rows called out before the stencil is cut. Counterfeit-avoidance practice follows AS5553 / AS6081.
ENCLOSURE
Box Build
Conformal coating to IPC-CC-830, cable harness assembly, IC programming, torque-controlled fastening, unit-level functional test and a serial number tied to the build record.
VOLUME
Prototype to Production
1–10 pieces in 3–7 working days, 10–1,000 pieces in 5–10 working days, 5,000 pieces in about 3 weeks. First-article inspection runs USD 100–300.
MEASURED, WITH THE BASIS ATTACHED
Four figures, and how each one is counted
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7 + 2
SMT and THT lines
Seven high-speed SMT lines and two THT assembly lines on one site.
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300,000+
boards per month
Single-site monthly capacity across both assembly technologies.
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≈5.6M
placements per day
Sustained, derived as 7 lines × 84,000 CPH rated × 24 h × 40% overall equipment effectiveness. Not a machine rating.
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FPY ≥98.5%
first-pass yield
First-pass yield measured at final inspection before any rework or retest, SMT + THT production lots; excludes pilot builds and post-ECN first articles.
On-time delivery is ≥98.7%, measured against the confirmed ship date at order acknowledgement and counted per shipment.
CERTIFICATION SCOPE
What each certificate covers, and what it does not
Certified for the quality management system covering SMT and THT assembly production services, first certified 2024. No certificate number is printed here; it is supplied with the audit pack on request.
Covers environmental management for SMT and THT production, first certified 2023.
First certified 2021. This is a quality management system certificate: it is not an FDA approval and not an EU MDR certificate.
First certified 2024. Permitted exclusion: product design.
RoHS 3 directive (EU) 2015/863 and REACH SVHC declarations with supporting test reports, available on request. A declaration and a test report, not a certificate.
Assembly acceptance to the class named on your drawing, with IPC-trained CIS and CIT staff on the floor. A conformance statement, not a certificate.
VERIFY IT YOURSELF
Four things you can check without asking us
We do not own a bare-board fab
Bare boards are sourced from audited partner fabs, with incoming inspection and full lot traceability. Ask for the incoming inspection record for your lot.
Inspection is configured per project
The baseline chain is automatic paste printing, 3D SPI, placement, reflow and AOI; X-Ray is added where the project needs it. Test items are quoted item by item, not asserted as blanket coverage.
Ratings and output are kept apart
84,000 CPH is a machine rating per the equipment specification. The ≈5.6M placements a day figure is a derivation from that rating at 40% overall equipment effectiveness, and it is labelled as one.
Lead time is quoted ex-components
Every date we give is an assembly lead time ex-components, counted after the last component is kitted. The bottleneck is normally the component, not the line.
NEXT STEP
Send the BOM and the stackup
Tell us the board thickness, the smallest package and the annual volume. We will come back with the line we would run it on, the parameters that apply and the DFM points we can already see.
Reply within one business day
Files accepted: Gerber X2 / X3, ODB++, IPC-2581, Excellon drill, pick-and-place centroid and a BOM carrying MPN, manufacturer and reference designators.