Line 01
SMT Assembly
Placement from 03015 metric (01005 imperial) to 100 × 90 mm connectors, with QFP and BGA at 0.4 mm pitch, checked by 3D SPI and inline AOI.
PCBA CONTRACT MANUFACTURING · SHENZHEN
Prototype on Monday. Production by Friday.
SMT and DIP assembly on one site in Bao'an, Shenzhen: 7 high-speed SMT lines and 2 THT lines producing 300,000+ boards a month, running prototype-to-production builds on the same placement programme, the same stencils and the same quality system.
- IPC-A-610 Class 2 / 3
- ISO 9001 · 14001 · 13485 · IATF 16949
- Assembly lead time ex-components: 3–4 weeks
- Reply within one business day
PROCESS FLOW · ONE DIRECTION
Seven stations, one unbroken pass
Boards move left to right and never re-enter a station: paste printing, solder paste inspection, placement, reflow, AOI, DIP and test, then packing. Each step below carries the parameter that governs it.
01 · Paste printing
Printing
Laser-cut stainless stencil with nano coating, area ratio ≥ 0.66 for 01005 chips and 0.4 mm pitch.
02 · Paste inspection
SPI
3D SPI closes the loop on four metrics: paste volume, height, area and offset.
03 · Placement
Placement
Panasonic NPM-D3 modular placers, 84,000 CPH rated, placement accuracy ±25 µm.
04 · Reflow
Reflow
Ten-zone forced-air convection with SAC305 lead-free paste; nitrogen reflow optional at O2 ≤ 1,000 ppm.
05 · Post-reflow inspection
AOI
Inline 2D/3D AOI for missing parts, offset, polarity, bridging and insufficient solder.
06 · Through-hole and test
DIP & test
Dual-wave and robotic selective soldering on 2 THT lines; ICT, flying probe, FCT and Hi-Pot.
07 · Packing
Packing
ESD bag, moisture-barrier bag, desiccant and humidity indicator card; boards ship as panels or depanelised.
CAPACITY, IN NUMBERS
What the plant actually runs
Every figure here is either a plant fact or a derivation with its basis written next to it, so a procurement team can drop the whole band into a supplier file and check each line.
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Since 2006
Operating history
Twentieth year of PCBA contract manufacturing, on the same single site in Bao'an, Shenzhen.
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10,000 m²
Single-site plant
SMT, THT, test, coating and box build at one address, with no sub-assembly handed to a third party.
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7
High-speed SMT lines
Panasonic NPM-D3 modular placers, rated at 84,000 CPH each, taking 03015 metric chips and 0.4 mm pitch.
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2
THT and DIP lines
Dual-wave soldering plus robotic selective soldering for mixed-technology assemblies.
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2
Functional test lines
ICT, flying probe, FCT and Hi-Pot; AOI and X-Ray scope is configured per project, not claimed line-wide.
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300,000+
Boards per month
Monthly board output across SMT and THT assembly, with prototype runs sharing the same lines.
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60+
Countries served
Around 75% of revenue comes from Europe and North America, with English-speaking project managers in Shenzhen time.
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≈5.6M
Placements per day, sustained
7 lines × 84,000 CPH × 24 h × 40% OEE, where the 40% OEE is a typical industry assumption rather than a measured plant figure.
INDUSTRIES SERVED
Six regulated sectors, six different rulebooks
Each sector below carries its own admission requirements. Start with the one that matches your product; the constraint line is what a supplier audit will ask about first.
Germany · USA
Industrial Automation & Controls
No mandatory quality system, but buyers specify ISO 9001, wide-temperature parts from −40 to +85 °C, vibration and EMC consistency, and 10+ year supply with planned ECNs.
USA · EUMedical Devices
FDA 21 CFR 820 and EU MDR 2017/745: ISO 13485, lot-level traceability, IQ/OQ/PQ validation documents, change notification, and sterility limits on component heat tolerance.
Nordics · GermanyAutomotive & EV
IATF 16949 with PPAP and AEC-Q parts, 8D reporting at 24-hour containment and 10-day root cause, over −40 to +125 °C temperature cycling.
USA · EUConsumer Electronics & IoT
FCC Part 15, CE RED, RoHS and WEEE: week-level iteration, early DFM feedback, cost steps from prototype to volume, and antenna layout planned before certification testing.
Netherlands · USAEnergy, Power & Grid
UL 508A control assemblies, IEC 62477 and grid codes: 2–6 oz copper, creepage distance, UL 94V-0 materials and 15–25 year field life.
USA · EUTelecom & Data Centre
NEBS (Telcordia GR-63 and GR-1089): 25/56/112 Gbps PAM4 signal integrity, back-drilling, large panel handling, and BGA void control on high-density packages.
FACTORY FLOOR
One address, and the equipment list to go with it
Bare boards arrive from audited partner fabs and are inspected on receipt with full lot traceability; from there, printing, placement, reflow, dual-wave and robotic selective soldering, test and packing all happen inside the same 10,000 m² building. We are an assembly plant, not a bare-board fab, and we say so before you ask.
- SMT lines
- 7 × NPM-D3
- THT & DIP
- 2 · dual-wave
- Board range
- 0.4 – 4.0 mm
- Clean area
- ISO Class 8
84,000 CPH
Rated placement rate
A machine rating per placer, not a plant output; sustained throughput is derived separately with its OEE assumption stated.
±25 µm
Placement accuracy
Machine-rated accuracy that makes 03015 metric chips and 0.4 mm pitch QFP and BGA packages placeable in volume.
INSPECTION CRITERIA
Acceptance criteria, not adjectives
Inspection scope is configured per project: 3D SPI after print, inline AOI after reflow, and 2D X-Ray where BGA, CSP or QFN hidden joints are present. What does not change is the standard each joint is judged against.
Judgement criteria
BGA voiding — IPC-7095 Class 2
≤ 25% single void / ≤ 40% total, per pad
BGA voiding — IPC-7095 Class 3
≤ 10% single void / ≤ 25% total, per pad
Through-hole fill and wetting — IPC J-STD-001
Hand soldering and rework to IPC-A-610 Class 2/3 and IPC-7711/7721
Ionic contamination — ROSE to IPC-TM-650
Class 2 ≤ 1.56 / Class 3 ≤ 0.78 µg NaCl eq/cm²
First-article inspection reports carry the SPI and AOI data with the visual criteria, so an accept or reject decision traces back to a standard line rather than to an opinion. Solder paste is verified on volume, height, area and offset; AOI covers missing parts, offset, polarity, bridging and insufficient solder.
CERTIFICATION & COMPLIANCE
Systems that can be audited, not just printed
Each certificate is issued to VOLTCIRCUIT and can be confirmed with the issuing body under our company name and the scope shown here. No certificate numbers are published on this site.
ISO 9001:2015
Quality management system covering SMT and THT assembly production services.
First certified 2024ISO 14001:2015
Environmental management system for SMT and THT production.
First certified 2023ISO 13485:2016
Medical device quality management system, scope “Production of PCBA”. QMS certificate — not an FDA clearance and not an EU MDR certificate.
First certified 2021IATF 16949:2016
Automotive quality management system, scope “Manufacturing of Circuit Board Components”. Permitted exclusion: product design.
First certified 2024RoHS 3 / REACH SVHC
Substance compliance under EU 2015/863 and the REACH SVHC list: declaration and test reports available on request. This is a declaration, not a certificate.
Status: currentConflict minerals 3TG — CMRT
Smelter and refiner source disclosure reported annually: CMRT available on request. Not a certification.
Annual disclosureCAPABILITIES
Capability lines, each with its own numbers
Prototype orders and volume orders run down the same seven lines, so the process you qualify during NPI is the process you get in production. Each card opens the detail page for that line.
Line 02
Through-Hole & DIP
Two THT lines running dual-wave soldering and robotic selective soldering with a single-point nozzle, filled and wetted to IPC J-STD-001.
Line 03
Mixed-Technology
SMT and through-hole on one assembly: pin-in-paste, press-fit and riveting for connectors that cannot take wave solder heat, reworked to IPC-7711/7721.
Line 04
Testing & Inspection
ICT bed-of-nails fixtures, functional test stands, JTAG boundary scan, flying probe for small batches, burn-in and Hi-Pot safety testing on 2 test lines.
Line 05
Component Sourcing
BOM risk scan for lifecycle status, single-source and long-lead exposure, with counterfeit mitigation to AS5553 and AS6081 practice. Minimum order follows the package: 0603–2225, SOT, SOD and MELF at 50 pcs + 30 spares; other packages at 100 pcs + 50 spares.
Line 06
Box Build & Coating
Enclosure assembly, cable and harness build, IC programming, and acrylic, silicone or polyurethane conformal coating to IPC-CC-830 in an ISO Class 8 clean area.
Line 07
Prototype to Production
1–10 boards in 3–7 working days and 10–1,000 boards in 5–10 working days, then volume with an assembly lead time ex-components of 3–4 weeks. A first-round DFM report comes back within 24 hours on prototype builds.
Line 08
Conformal Coating & Depanelling
Acrylic, silicone and polyurethane coating applied to IPC-CC-830 with connectors masked, plus V-cut and router depanelling on 0.4–4.0 mm boards. Ionic cleanliness is verified by ROSE test to IPC-TM-650.
PROCESS DEPTH
Three places where the process decides the outcome
Most assembly failures are settled before the first board is placed: by stencil design, by how through-hole parts are soldered next to chip components, and by how much test coverage is engineered into the fixture.
Deep dive 01
Fine-pitch SMT
QFP and BGA at 0.4 mm pitch need more than a fast placer. Paste volume is set by a laser-cut stainless stencil with nano coating and an area ratio ≥ 0.66, verified by a 3D SPI closed loop on volume, height, area and offset, then reflowed on a ten-zone profile with nitrogen available at O2 ≤ 1,000 ppm. Hidden BGA and QFN joints are judged on IPC-7095 void limits, Class 2 or Class 3 as your drawing specifies.
Deep dive 02
Mixed-technology assembly
Boards carrying both SMT and through-hole parts are the normal case here, not an exception. Pin-in-paste and press-fit handle connectors that must not see wave solder; robotic selective soldering with a single-point nozzle keeps the turbulent wave away from adjacent chip components; through-hole fill and wetting follow IPC J-STD-001, and manual soldering and rework follow IPC-A-610 Class 2/3 with IPC-7711/7721 procedures.
Deep dive 03
Test development
Test is engineered, not borrowed. That means ICT bed-of-nails fixture design, functional test stands with program development, JTAG boundary scan and IC programming. Flying probe suits volumes under 500 boards a year; a bed-of-nails fixture pays back above 2,000 boards a year, where ICT cycle time per board is 5–30 seconds. Fixture NRE runs from USD 2,000 for general fixtures to USD 50,000+ for complex ICT needle beds.
ANONYMISED CASES
What changed on three customer programmes
Customer names are withheld under NDA. What is shown is the customer type, the region, the constraint that made the programme difficult, and the measured result.
German industrial-controls OEM
A 14-layer controller board mixing 0.4 mm pitch BGA with 01005 chips; the previous supplier exceeded the void limits. The build moved to IPC-7095 Class 2 criteria with nitrogen reflow, and the incoming inspection regime was renegotiated.
Volume FPY 93% → 98.6% · incoming inspection from full check to AQL sampling
US Class II medical device company
An 8-layer patient-monitor main board that needed an ISO 13485 quality system with lot-level traceability, plus an IQ/OQ/PQ validation document package and change notification before any process change.
3 years in volume production · 0 field recalls
Nordic EV charging module brand
A 6-layer, 3 oz copper power board with a selective-soldering requirement. Robotic selective soldering replaced manual touch-up on the through-hole joints, which removed the operator-dependent step from the line.
Solder-joint rework rate 4.1% → 0.3%
VERIFY IT YOURSELF
How to check the claims on this page
A supplier claim is only worth what a buyer can audit. Each line below states how the figure behind it is measured and how you can confirm it independently.
Yield figures are internal KPIs, shown with their basis
First-pass yield ≥ 98.5% is measured at final inspection before any rework or retest, on SMT and THT production lots, excluding pilot builds and post-ECN first articles. The definition can be written into the quality agreement and audited.
Delivery performance is counted per shipment
On-time delivery ≥ 98.7% is measured against the confirmed ship date at order acknowledgement, counted per shipment. Component delays sit outside that figure, which is why lead time is always quoted as assembly lead time ex-components.
Certificates verify with the issuing body
ISO 9001, ISO 14001, ISO 13485 and IATF 16949 certificates are issued to VOLTCIRCUIT with the scopes listed above, and each one can be confirmed with the certification body under our company name. RoHS and REACH documentation and the CMRT are supplied on request.
Bare boards are sourced, and case data stays anonymous
We do not operate a bare-board fabrication plant: bare boards come from audited partner fabs, with incoming inspection and full lot traceability on receipt. Case results are anonymised because customer names are withheld under NDA, and reference calls in your sector can be arranged on request.
REQUEST A QUOTE
Send Gerbers, a BOM and a target volume
A quote comes back with the assembly lead time ex-components in working days, the inspection scope for your board, the minimum order that follows from your component packages, and a first-round DFM report within 24 hours on prototype builds.
Reply within one business day
Gerber, BOM and pick-and-place data are enough to start. NDAs are standard, and files are held in access-restricted storage.